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POCO X7 Pro 5G detailed specs sheet leaked comes with new Dimensity 8400 Ultra SoC.

POCO is all set to launch the new POCO X7 series later next month in India and Global regions. Ahead of the launch we already got the detailed specs of the new POCO X7 5G. Now we have the new leak revealing the specs of the higher-end POCO X7 Pro 5G.

POCO X7 Pro:

The new POCO X7 Pro will sport a 6.67-inch 1.5K AMOLED display with a 120Hz refresh rate. It will have a peak brightness of 3000 nits and supports 10-bit colours, Dolby Vision, HDR10, and HDR10+. The device comes with Corning Gorilla Glass 7i on top & in-display fingerprint scanner.

 

POCO X7 Pro comes with the latest Dimensity 8400 Ultra processor coupled with 8GB/12GB/16GB RAM and 128GB/256GB/512GB storage space.

 

The POCO X7 Pro will feature a new 50MP Sony IMX882 (f/1.5) with OIS support. The remaining two sensors are the same with 8MP ultra-wide and 2MP macro sensors.

POCO X7 Pro will ship with a 20MP selfie shooter. It also features IR Blaster support & IP68 rated on both devices.

The connectivity options include dual SIM, 5G, Wi-Fi 6, Bluetooth 5.4, GPS, NFC, a USB-C port, a linear motor, and dual stereo speakers. The POCO X7 Pro packs a 6000mAh battery with 90W fast charge support respectively. It runs on Android 15 OS with HyperOS 2 on top.

 

Nothing officially revealed its next smartphone launch timeline, could be CMF Phone 2.

In early 2025, all smartphones manufactured by Nothing will be powered by Nothing OS 3.0, a technology developed by the UK-based tech company. The next Nothing product will be released in April 2025, according to a new YouTube video uploaded to the brand’s YouTube channel.

Although nothing in particular has been revealed about the next Nothing product, Lucy Birley – CMF Designer said in a conversation between Heru and Lucy that the next Nothing product is in the works and it’s supposed to hit the market in April 2025 next year. This upcoming device is also expected to come in a Blue color option based on the hints.

Previously, it was thought that Nothing would release two Phone (3) series models with the monikers ‘Nothing Phone (3)’ and ‘Nothing Phone (3) Pro’ soon. However, using GSMA’s IMEI database, we found out they’re the next ‘Nothing Phone (3a)’ and ‘Nothing Phone (3a) Plus’ with model numbers A059 and A059P, respectively. The codenames are also ‘asteroids’ and ‘asteroids_plus’. Plus, it’s spotted on Geekbench, so it might use Snapdragon 7s Gen 3.

CMF Phone 2 with model number – ‘A0001’ and codename – ‘galaga’ is also confirmed to be powered by a Snapdragon 7s Gen 3 processor and appeared in the GSMA IMEI database along with these two smartphones.

OPPO starts teasing the new OPPO Reno13 series in India, first look with key specs revealed.

Oppo unveiled the Reno13 and Reno13 Pro in China in November, both equipped with the Dimensity 8350. The brand has begun teasing the arrival of the Reno13 series for the global market starting today. Three devices will be available, including the Reno 13F, Reno 13, and Reno 13 Pro.

In January 2025, the Reno13 series will be available in multiple markets. Preorders for the three devices in the lineup have already begun at the Malaysian branch of the brand: Reno 13F, Reno 13, and Reno 13 Pro. Other markets, such as India, may receive the Reno 13 and Reno 13 Pro.

Oppo India’s website and Flipkart have revealed the colour variants of the Reno 13 and 13 Pro for the Indian market.

According to Oppo, the Reno13 5G will be available in two colour options: Ivory White and Luminous Blue. Blue variants, which were designed specifically for Indian markets, have a glowing effect around the camera island, according to the brand. Using offset printing and reflective coating, the company achieved the glow effect.

On the other hand, the Reno13 Pro 5G will be available in two colours: Mist Lavender and Graphite Grey. In terms of overall design, the Reno13 and 13 Pro are identical to their Chinese counterparts.

Key Specs:

Reno13 is designed with an aluminium frame made of aerospace-grade material. The white Reno13 has a thickness of 7.24mm, while the blue variant has a thickness of 7.29mm. The Pro edition, however, measures 7.5mm thick. It weighs 181 grams for the Reno13 and 195 grams for the 13 Pro. The backs of both phones are made of one-piece sculpted glass.

The OLED panels on both devices are protected by Gorilla Glass 7i on the front. The Reno 13 has slim bezels of 1.62mm and a screen-to-body ratio of 93.8 percent, whereas the Reno 13 Pro has bezels of 1.81mm and a screen-to-body ratio of 93.4 percent. IP66, IP68, and IP69 are the three IP ratings for the series.

On Geekbench, the Reno13 Pro with model number CPH2697 has surfaced. Based on the listing, it could be powered by the Dimensity 8350 or Dimensity 8300. As well as 12 GB of RAM, Android 15 is also revealed.

During the first week of January 2025, the Reno13 series will be launched. On January 9, 2025, an open sale is scheduled to begin on the OPPO India website.

  • Additional offers may be announced closer to the launch, including bonus exchanges of up to Rs. 8,000.

  • The “Notify Me” option provides 5,000 points for raffles or device purchases after launch.

Realme announced it will invest Rs.100 Crore for developing quad-cured OLED displays.

Realme has committed approximately INR 100 crore to develop quad-curved display technology for its smartphones globally. Providing cutting-edge technology and unparalleled user experiences is Realme’s commitment to its customers.

With the launch of the realme 14 Pro series 5G, realme sets a new benchmark in display technology. With its bezel-less quad-curve design, the realme 14 Pro series pushes the limits of smartphone aesthetics and functionality.

India’s slimmest bezels, measuring just 1.6mm on all four sides, are found on the realme 14 Pro series 5G. As a result, the screen-to-body ratio is 93.8%, creating an almost borderless viewing experience.

The display of the realme 14 Pro series 5G has been meticulously optimized for an unparalleled visual experience, according to the company. Every element of the screen is designed to enhance the user’s interaction with their digital world, including precision-engineered bezels and advanced eye protection.

Investment for the future:

Realme’s INR 100 crore investment will focus on researching and developing advanced display manufacturing techniques. As a result, realme will remain at the forefront of providing premium smartphone experiences. The realme brand continues to solidify its position in the global smartphone market by combining groundbreaking design with the latest technological advancements.

With this investment, realme continues to push the boundaries of smartphone innovation and introduces a new era of immersive and engaging mobile experiences.

OPPO Find X8 Ultra camera specs leaked again features dual-telephoto Sony lens.

According to company officials, the Oppo Find X8 Ultra will launch in China after the Find N5 foldable. The device will, however, undoubtedly be a powerful smartphone with a powerful camera.

The Find X8 Ultra’s standout feature will be its dual telephoto cameras, similar to its predecessor. Now, a reliable Chinese tipster has shared detailed specifications for these zoom lenses.

Digital Chat Station reports that the first telephoto lens will be equipped with a 50MP Sony IMX906 sensor with a large 1/1.56-inch sensor size and offer a 3x optical zoom.

The second telephoto lens will feature a 50MP Sony IMX882 sensor with a 1/1.953-inch sensor size and an impressive 6x periscope zoom.

According to previous reports, the phone is said to have a 50MP Sony LYT900 primary sensor with a 1-inch optical format and an ultra-wide 50MP Sony IMX882 lens. In a previous report, we got a glimpse at the internal layout of the Find X8 Ultra in comparison to the Find X7 Ultra. There is no doubt that the telephoto sensors are bigger, however.

MediaTek announced the new mid-range chipset Dimensity 8400 SoC, brings Gen AI support and All Big Core design.

A new Dimensity 8400 processor has been announced by MediaTek for smartphones. It uses an all-Big Core design similar to that of the Dimensity 9400. In addition to boosting performance by 41%, the new chipset also supports Generative AI.

The Dimensity 8400 replaces the Dimensity 8300. It uses the same design as Dimensity 9400, which is a flagship-grade chip. With eight Cortex-A725 cores, it has an octa-core configuration. Its maximum clock speed is 3.25GHz.

Dimensity 8400 offers 41% better multi-core performance and 44% lower power consumption than its predecessor. In addition to maintaining peak performance in extended usage, the chipset has been tuned for maximum efficiency.

It has a Mali-G720 GPU. The new GPU is 24% faster and 42% more power-efficient. This phone supports MediaTek Frame Rate Converter (MFRC) and MediaTek Adaptive Gaming Technology (MAGT) 3.0, which optimizes gameplay for higher frame rates.

In terms of AI, the Dimensity 8400 shines. It has the NPU 880, which supports all large language models, SLMs, and LMMs. Additionally, the NPU supports generative AI features like translation, rewriting, contextual responses, AI recording, AI-powered media creation, etc. Additionally, MediaTek DAE support lets developers use the chipset for AI tasks, and this feature is taken from the top-end Dimensity 9400.

Dimensity 8400 features MediaTek Imagiq 1080 ISP for image processing. With HDR support, high-resolution images can be processed faster.

The device supports download speeds of up to 5.17 Gbps.For internet connectivity, it can seamlessly switch between Wi-Fi and 5G networks.

Samsung’s upcoming budget 5G Galaxy M16 5G press renders leaked online.

Samsung launched the Galaxy M15 earlier this year as the latest member of its affordable mid-range smartphone lineup with large batteries. An new leak reveals the first detailed renders of the South Korean giant’s upcoming successor. Here is a look at all three colourways of Samsung’s Galaxy M16 5G, leaving nothing to the imagination.

There are sharper border lines on the flat sides of the Galaxy M16 5G compared to its predecessor. Samsung has already incorporated a flat frame on the Galaxy M15, but the edges still have a slight curve, which gives it an “outdated” look. The next-gen Samsung phone will ditch this design in favour of something more similar to Samsung’s newest flagship and mid-range devices.

The company has chosen to take a less minimalist approach to its camera module design. There will be three rear camera sensors arranged vertically, surrounded by an “island” on the Galaxy M16 5G. Samsung is bringing a new design language to its upcoming affordable phones, but is this the beginning of something new? We’ll have to wait and see.

On the left side of the Galaxy M16 5G, there is a SIM card slot, while on the right are power and volume buttons, as well as a fingerprint reader. The fact that Samsung continues to use side-mounted fingerprint readers on AMOLED phones is interesting.

Samsung will also retain the Infinity-U notch for the front camera sensor, something that was dropped on the Galaxy A16.

Nothing Phone (3a), Phone (3a) Plus and CMF Phone 2 key specs leaked online.

The unique focus on style without compromising substance has made Nothing some well-deserved hype in the smartphone space. The Nothing Phone 3 looks great, and we’re eager to see what it will bring to the table in the future. Before we get to the top, we’ve spotted the specs of the company’s budget offerings, which are likely to be the Nothing Phone 3a, Phone 3a Plus, and CMF Phone 2.

Recent Nothing OS 3.0 builds based on Android 15 revealed certain specifications and other details about upcoming Nothing devices. The codenames asteroids, asteroids_plus, and galaga may be related to upcoming Nothing phones. This codename is said to be for the Nothing Phone 3a (asteroids), Nothing Phone 3a Plus (asteroids_plus), and the CMF Phone 2 (galaga).

The CMF Phone 2 will run a MediaTek SoC, while the Nothing Phone 3a and Phone 3a Plus will utilize the Snapdragon 7s Gen 3 SoC.

Further clues suggest the Phone 3a could have a telephoto camera, while the Phone 3a Plus could have a periscope zoom camera. Accordingly, the Phone 3a series could be the first in the Nothing lineup to come with optical zoom sensors instead of wide and ultrawide rear cameras.

Interestingly, the Nothing Phone 3a and Phone 3a Plus may be the company’s first phones to support eSIM. Users can likely use two nano-SIMs or one eSIM with an eSIM for dual-SIM configurations. CMF Phone 2, however, will likely stick to physical SIMs only.

Here is when Samsung Galaxy S25 series going on sale, will arrive with this chipset globally.

The Galaxy S25 smartphone lineup is expected to be announced at Samsung’s next Galaxy Unpacked event on January 22. There’s new info about when Samsung’s next-gen flagships will be available.

On January 17, Samsung announced the Galaxy S24 at an Unpacked event, and pre-orders opened ahead of its release on January 31. Given that the official announcement is expected to occur later in 2025, it is only natural that availability would also be delayed accordingly. According to South Korea’s Financial News, Samsung plans to release the Galaxy S25 on February 7, at least in its home country. It doesn’t mention other markets directly, but international availability should be similar.

Samsung may showcase the rumoured Galaxy S25 Slim at the launch event, even though sales for this model may be some time away.

ETNews reports that the entire Galaxy S25 series will be powered by Snapdragon hardware. Galaxy S25 and Galaxy S25 Plus were initially intended to use Exynos 2500 in most regions. Meanwhile, the Galaxy S25 Ultra was already going to use the Snapdragon 8 Elite. Samsung has followed this strategy for its “Galaxy Ultra” mobile devices in recent years.

 

Realme started teasing the new Realme Neo 7 SE to be powered by this new chipset.

MediaTek announced its latest chipset powerhouse, the Dimensity 8400, this morning. On its Weibo account, Realme teased an upcoming smartphone launch shortly after. A teaser shared by Realme showcases the new Dimensity 8400 SoC’s design schematic.

Despite Realme keeping its name under wraps, reliable tipster DCS revealed the device’s name. DCS reports that the upcoming device will be branded as the Realme Neo 7 SE, joining its recent sibling, the Realme Neo 7.

MediaTek’s press release confirms the launch of a phone with the Dimensity 8400 by the end of the year. Redmi is also preparing to launch its Turbo 4 with the Dimensity 8400 Ultra.

Realme and Redmi are now competing. In China, Redmi has begun taking reservations for the Turbo 4, which will be launched in January 2025. We’re waiting to see which brand will release the first Dimensity 8400 phone after Realme teased theirs.

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