The chipset choice for Samsung’s upcoming Galaxy S25 family has recently been a hot rumoured topic. There have been reports that Exynos 2500 yields are low enough for Samsung to use all-Snapdragon SoCs in the Galaxy S25 family, but MediaTek Dimensity 9400 is also being considered.
According to a new rumour, only the Galaxy S25 FE will use the Dimensity chip, despite Samsung and MediaTek negotiating regarding the entire S25 family. Yet the S25, S25+, and S25 Ultra are said to all use Snapdragon chips, leaving the FE model with presumably Dimensity 9400, unless Samsung opts for an older and cheaper SoC from Taiwan.
As a result, the Exynos 2500 may still turn up in the next Galaxy Z Fold and Flip device due to launch next summer, as Samsung will hopefully have resolved its yield issues by then.
Galaxy S25 Ultra updated renders:
Samsung Galaxy S25 Ultra camera rumours fell through – the latest report claims the ultra-wide camera will be upgraded to a 50MP sensor (ISOCELL JN3) and that’s it. There will be a 200MP ISOCELL HP2 as the main camera, a 10MP Sony IMX754 as the 10MP module, and a 50MP Sony IMX854 as the 5MP module.
However, the cameras will look different. An image shared by leakster Ice Universe shows the new design for the individual camera lenses, which have a thick, dark ring around them.
Other S25 models have used the same design language. Like the Galaxy Z Fold6, it has no extra bump around all the cameras. The back of the case should be completely flat so that cases can be made completely flat.
As long as the layout of the cameras remains the same, the Galaxy S25 phones will appear the same. The Galaxy S25 Ultra stands out from its predecessors with rounded corners and improved ergonomics.
