According to rumors, the Vivo X200 and X200 Pro will be the world’s first phones with Dimensity 9400 chips when they debut in China in October. Digital Chat Station released a sketch today showing the Vivo X200 & Oppo Find X8 design changes.
Vivo X200:
The ZEISS logo on the camera module in the below sketch clearly indicates that this is a schematic for an X200 series phone. Reports indicate that the X200 Pro will feature a curved-edge OLED panel, whereas the standard X200 may have a flat display. X100 and X100 Pro had curved-edge OLED panels, but the X200 Pro may feature a flat display. Therefore, the schematic probably belongs to the Vivo X200.
Above the display punch-hole, an earpiece can be seen lodged in the top bezel. On its right edge, the device has a volume rocker and a power key.
On its back panel, the X200 features a round camera module with an LED flash unit positioned at its upper-right corner. There are four rings inside the round module. It is speculated that the X200 will have a triple camera setup led by a 50-megapixel primary camera.
OPPO Find X8:
According to DCS, the Find X8 will have a flat screen, whereas the X8 Pro and X8 Ultra will have micro-curve displays. According to the below image, the Find X8 appears to have a flat display.
On the Find X8, the top bezel has an earpiece. On the left side of the device is an alert slider and on the right is a volume rocker and power button.
It features a round camera module with four camera rings and a Hasselblad logo in the middle. The standard variant is said to have a triple camera setup. On the module’s upper-left corner is an LED flash.
Compared to the Find X7, which debuted in January this year, it has a curved display instead of a flat screen. Moreover, the layout of the round camera module on the back is slightly different from that on the iPhone.
