According to reports, Redmi is working on the Note 14 series of smartphones for China. Probably in August or September, the company will release it. Weibo user Digital Chat Station revealed the design of the Note 14 Pro earlier this month. According to the tipster, the device will be powered by a Snapdragon 7s Gen 3 processor. It appears that DCS has revealed that the Note 14 Pro+ will have a Dimensity chip in a new Weibo post.
DCS has not disclosed the name in the post on Weibo. There is a possibility that he is referring to a smartphone in the Note 14 series. The leaker described the device as having a “super cup” in the leak, which indicates that it could be the Redmi Note 14 Pro+.
Redmi Note 14 Pro+ may feature a 1.5K resolution curved-edge OLED panel, according to the leak. On the phone’s back, there will be an elliptical camera module with a 50-megapixel primary camera. It was revealed in the Note 14 Pro design schematic that it could be a square camera module.
There will be an optical fingerprint sensor on the screen of the Note 14 Pro+, according to the leaker. It is powered by TSMC’s second-generation Dimensity chipset built on a 4nm process with a 3GHz base frequency. According to him, the device is powered by the Dimensity 7350 chipset. In India, Nothing Phone (2a) Plus is scheduled to launch on July 31 with this chip.
