In addition to Dimensity 6020 and 6080, MediaTek has now launched the MediaTek Dimensity 6100+ in its 6000 series. It is expected that the Dimensity 6100+ will be a rebranded version of the lower-midrange Dimensity 810 5G chipset.
With its 4nm-based manufacturing process, the Dimensity 6100+ SoC offers remarkable power efficiency compared to its predecessors. The device supports vibrant displays, high frame rates, AI-powered camera technologies, low power consumption, and reliable Sub-6 5G connectivity.
With impressive specifications and features, the MediaTek Dimensity 6100+ SoC is a great choice. This device features an octa-core CPU with a maximum clock speed of 2.95 GHz Cortex-A78 and a Mali-G77 MC9 GPU for smooth graphics rendering. With its 2x 14-bit ISP, the SoC supports up to 200MP single cameras or 3x 64MP cameras.
The Dimensity 6100+ SoC supports immersive displays up to 144Hz Full HD+ or 90Hz Quad HD+ refresh rates. Connectivity options include 5G Sub-6, Wi-Fi 6E, Bluetooth 5.3, GPS, and NFC for reliable connectivity. With the SoC, you can store up to 1TB of data on UFS 3.1, and you can use up to 16GB of RAM on LPDDR5.
Dimensity 6100+ SoC features MediaTek HyperEngine 5.0 gaming technology, optimizing gaming performance. Moreover, MediaTek’s AI-powered camera technologies enhance photography capabilities, allowing advanced features and image enhancement.
With a power efficiency of up to 70%, improved image processing, and improved AI performance, the Dimensity 6100+ SoC is expected to debut in smartphones in the third quarter of 2023.
