MediaTek has now announced its mid-range chipset after the Qualcomm announcement with the new Dimensity 1050 SoC. Not only this we also have two cheaper chipsets announced with Dimensity 930 SoC & MediaTek Helio G99 SoC. MediaTek has announced its very first chipset with mmWave 5G support with Dimensity 1050.
The new Dimensity 1050 SoC is built on a 6nm TSMC process & will be out by Q3 of 2022. The Dimensity 1050 also comes with the world’s first Wifi-7 integration with Filogic 880 and Filogic 380 with Wi-Fi 7 and Bluetooth 5.3 integration. The new Dimensity 1050 comes with powerful two Cortex A78 cores clocked at 2.5GHz. It is coupled with six Cortex A55 power-efficient cores clocked at 2.0 GHz.
The Dimensity 1050 SoC ships with Mali-G610 MC3 GPU & comes with 4CC carrier aggregation, while Sub-6 is limited to 3CC.
The Dimensity 930 SoC & Helio G99 SoC both are built on a 6nm TSMC process. Yes, the Helio G96 which was built on a 12nm process gets upgraded with a faster 6nm process built Helio G99 SoC. Further, the Dimensity 930 SoC gets better & faster connectivity options with 120Hz Full HD+ displays with HDR10+support.
