Zhou Yibao, Oppo’s Product Manager for flagship products, said that the Find X8S would feature an ultra-thin bezel on all four sides, smaller than that of the Apple iPhone 16 Pro Max. Oppo is anticipated to release more Find X8 phones in April.
For the tiny bezel, which will measure “1.xx mm,” the business used a novel COP (Chip-on-Panel) packaging that Oppo invented. This approach eliminates the requirement for a separate, bigger driver IC by integrating the display driver chip right into the screen.
Although such technology is more energy-efficient and allows for the decrease of bezels, it has significant disadvantages. It costs a little more than conventional screen technology and requires more work.
We anticipate Oppo unveiling the Find X8S as the lineup’s Mini model. In addition to the highly anticipated Find X8 Ultra with five cameras, there should be a variant dubbed Find X8S+.
