Sometimes, it’s necessary to do some digging for new chipsets. MediaTek’s Dimensity 6400 chipset is a light update from last year’s Dimensity 6300, an upgrade from 2023’s 6100+. Its roots go even further back than that.
The Dimensity 6400 is manufactured using a 6nm TSMC process. It has an octa-core processor: two Cortex-A76s at 2.5GHz and six A55s at 2.0GHz. The device also has an ARM Mali-G57 MC2 GPU.
It supports LPDDR4X RAM (up to 2,133MHz) and UFS 2.2 storage. With a refresh rate 120Hz and 10-bit colours, it supports displays with up to 1080p+ resolution. The ISP supports 108MP cameras (there is no word on video resolution). With a peak downlink speed of 3.3Gbps, the 5G Release 16 modem also supports Wi-Fi 5 (ac) and Bluetooth 5.2.
MediaTek doesn’t go into specifics, but this is the Dimensity 6300 with a 0.1GHz overclock on the A76 cores and possibly the GPU. The Dimensity 810 from 2021 uses a 2x A76 + 6x A55 + Mali-G57 MC2 combination. This is an old design.
Although it is less capable than the 6400 – with a 64MP camera, a 5G modem that tops out at 2.77Gbps, and older Bluetooth 5.1 – it is still a 6nm chip. Even so, it’s very similar to the hardware from four years ago.
The Dimensity 6400 will power new designs, such as Realme’s P3x 5G, which will be unveiled tomorrow.
