MediaTek announced its latest chipset powerhouse, the Dimensity 8400, this morning. On its Weibo account, Realme teased an upcoming smartphone launch shortly after. A teaser shared by Realme showcases the new Dimensity 8400 SoC’s design schematic.
Despite Realme keeping its name under wraps, reliable tipster DCS revealed the device’s name. DCS reports that the upcoming device will be branded as the Realme Neo 7 SE, joining its recent sibling, the Realme Neo 7.
MediaTek’s press release confirms the launch of a phone with the Dimensity 8400 by the end of the year. Redmi is also preparing to launch its Turbo 4 with the Dimensity 8400 Ultra.
Realme and Redmi are now competing. In China, Redmi has begun taking reservations for the Turbo 4, which will be launched in January 2025. We’re waiting to see which brand will release the first Dimensity 8400 phone after Realme teased theirs.
