Samsung Galaxy S25 Ultra will be the thinnest Galaxy Ultra phone in years, according to leaks. It was recently revealed, however, that the standard Galaxy S25 could also be a slim device. This gives us a good idea of how the two phones will compare.

Galaxy S25:

An image posted by tipster Ice Universe appears to show mock-ups of the Galaxy S25 and S25 Ultra. In the image, the camera bumps and thickness of the two devices are compared.

In comparison to the S25 Ultra’s 8.2mm thickness, the standard Galaxy S25 is expected to be 7.2mm thick. As a result, the vanilla model will be substantially thinner than the Ultra model. There are no major camera upgrades expected for the standard Galaxy S25, which may contribute to its slim design. Both Samsung phones will be slimmer than their predecessors, regardless.

The Ice Universe also posted a comparison of the Galaxy S25 Ultra and iPhone 16 Pro Max, indicating that the iPhone 16 Pro Max has a thicker camera bump than the S25 Ultra. Apple’s device is said to be 8.3mm thick, just 0.1mm thicker than the S25 Ultra. Samsung’s device looks a little thinner than the iPhone due to its camera bump.

Galaxy S25 Plus:

We’ve seen leaked renders for two phones in the Samsung Galaxy S25 series so far. Initially, we saw the Ultra model, followed by the vanilla model. The Samsung Galaxy S25 Plus has been leaked as the third entry in the upcoming series.

The renders show a phone that looks quite similar to the vanilla Galaxy S25. There is no doubt that the phone is significantly larger. It is speculated that the Plus variant could measure 158.4 x 75.7 x 7.3mm, which is larger than the vanilla Galaxy S25, which measures 146.9 x 70.4 x 7.2mm.

Both phones may be marginally thinner than their 2024 counterparts, however, based on these leaked dimensions.

There is also a flatness to the sides of the phone, which seems to be the new trend. With its semi-divisive design, the Galaxy S25 Plus looks more like an iPhone than ever before. On the back, we also see the new “warp pipe” camera lenses.