HMD is all set to launch tons of smartphones later this year. Previously we saw HMD planning to launch a new HMD Skyline. Now we have another premium mid-range smartphone that was teased at MWC called HMD Fusion. The HMD Fusion was touted to be HMD answer to modular phones.
HMD Fusion:
HMD Fusion will look similar to any other HMD smartphone with the punch-hole display on the front and thicker bezels. On the back, the device has a rectangular-shaped camera module carrying dual rear cameras. There is a magnetic POCO pin on the bottom of the device’s back. The device chassis is made out of recycled Aluminium along with a plastic back.
The device comes with Smart Outfits aka modular modules that look like case which can be attached with a magnetic POGO pin.
Specs:
HMD Fusion sports a 6.6-inch IPS LCD display with a Full HD+ resolution and 120Hz refresh rate. It is protected by Corning Gorilla Glass 3. The device is powered by Qualcomm QCM6490 SoC coupled with 8GB of RAM, and 256GB of storage.
The device features a 108MP main sensor coupled with a 2MP depth sensor. Within the punch-hole cutout is a 50MP camera for selfies. Moreover, it will be dust and splash-resistant, with an IP54 rating.
It’s powered by a 4800mAh battery and 30W fast charge support. There’s also a microSD card slot, a side-mounted fingerprint scanner, and a 3.5mm headphone jack. Other connectivity options include 5G, Wi-Fi 6E, Bluetooth 5.2, and NFC.
