On November 21, MediaTek will unveil its latest smartphone chipset, the Dimensity 8300. The chipset has been trickling out details in recent weeks, and now renowned tipster Digital Chat Station has compiled a comprehensive list.
Dimensity 8300 is made on TSMC’s 4nm process, according to the tipster. A single high-performance Cortex-A715 core runs at 3.35GHz, three Cortex-A715 performance cores run at 3.32GHz, and four power-efficient Cortex-A510 cores run at 2.2GHz. The Mali-G615 MC6 GPU handles the graphics.
Similar to the Dimensity 8200 chipset, it has 4+4 cores. Four Cortex-A715 cores handle performance-intensive tasks, while four Cortex-A510 cores handle efficiency-related tasks.
A Redmi phone believed to be part of the upcoming K70 series was also spotted using the Dimensity 8300 on Geekbench 6. Xiaomi 2311DRK48C achieved a single-core score of 1512 and a multi-core score of 4886. It’s a little faster than Dimensity 8200 and 8200-Ultra.
Dimensity 8300’s performance is expected to beat Qualcomm Snapdragon 7+ Gen 2’s, according to leaker Digital Chat Station.
On November 21, we’ll have more details about the Dimensity 8300’s capabilities and performance.
