Dimensity 9200 is MediaTek’s latest flagship chipset, bringing several industry firsts to smartphones. It is the first chipset to feature the ARM Cortex-X3 prime core clocked at 3.05 GHz and based on the ARMv9 architecture. It also features 3x Arm Cortex-A715 cores clocked at 2.85GHz and 4x Arm Cortex-A510 cores clocked at 1.8GHz. TSMC’s 2nd generation 4nm process (N4P) is used for the fabrication of the new chip.
In the graphics department, we have the ARM Immortalis-G715 GPU with hardware-based ray tracing. It features Variable Rate Shading (VRS), twice the machine learning performance of its predecessor, and ARM Fixed Rate Compression (AFRC) to reduce bandwidth consumption.
A new AI processing unit from MediaTek – the APU 690 – brings 35% improvements over its predecessor in the ETHZ5.0 benchmark app. As well as supporting LPDDR5X memory with speeds up to 8,533Mbps, the chipset supports UFS 4.0 storage for blazingly fast data transmission and direct storage access to the CPU.
The Dimensity 9200 supports up to two 5K resolution displays at 60Hz, one WHQD at 144Hz, and one 1080p at 240Hz. In addition, this chipset supports Wi-Fi 7 with 6.5Gbps data transfers. There is also sub-6Ghz and mmWave 5G connectivity, as well as Bluetooth 5.3.
With the Imagiq 890 ISP, RGBW sensors are natively supported along with 34% more power savings. It uses AI to reduce power consumption up to 30% using MediaTek’s eXtreme Power Saving Technology.
At this point, we are less than two months away from seeing the first Dimensity 9200 phone launch.
