According to Ice Universe leakster, the Snapdragon 888‘s successor will be known as the Snapdragon-898. Ice Universe also reported that the prime Cortex X2 core would be running at 3.09 GHz.
The single X2 may be paired with 3x Cortex A710, 4x Cortex A510 and the first ARMv9 designs. The X2 promises a 16% faster speed than the X1. A710 upgrades are more focused on energy efficiency (+30%). Remember that these numbers only pertain to cores made on the same process.
According to rumours, SD898 SoC will be produced at Samsung’s fourth-generation foundry. This process (known as 4LPE), was developed using the same 5nm process used in the production of the 888 chipsets. The Cat also said that Qualcomm plans to release a Snapdragon898+ chipset next year, which will move to TSMC’s 4-nm foundry.
Although the Snapdragon 888+ wasn’t able to switch foundries like its predecessor, it did increase its core CPU speed by a bit – from 2.0 GHz to 3.0 GHz. That one still has the same X1 core, so the upcoming chipset should have a bigger speed advantage speed-wise than just comparing clock speeds.
According to a previous leak, the Snapdragon 898 will come with a next-generation GPU (Adreno730), X655G modem (the best 10 Gbps modem), and an upgraded ISP, NPU and ISP. Numerous Chinese companies are said to be testing the 898. The first phones equipped with the new chip should then be released.
