With the popularity of the new flagship chip SD865 SoC the company has already begun works on the successor for the 2021 flagship. Previously we had got a few leaks which revealed some of the features of the next chipset. Now finally one of the sources managed to get the detailed specs of the new SD875 SoC.
As per the source, they had got the details of the new flagship processor SD875 SoC through an email by one of the tipsters. The company is planning for new 5G modem for next year with the new Qualcomm X60 5G modem-RF system. The source has still not confirmed whether the modem will be part of the SD875 SoC or will be optional as we saw with SD865 SoC.
Further, the flagship SD875 SoC is codenamed as SM8350 as the predecessor came with codename SM8250. The new SD875 SoC will be built on 5nm process which might take less space and juice of the device also brings significant performance and graphics improvement over the SD865 SoC.
The new SD875 SoC will ship with Kyro 685 GPU built on ARM V8 Cortex tech coupled with Adreno 660 GPU, Adreno 665 VPU, and Adreno 1095 DPU. The SD875 SoC will have 3G/ 4G/ 5G modem –Millimeter wave (mmWave) and sub-6 GHz bands. It also features Qualcomm Secure Processing Unit (SPU250) along with Spectra 580 image-processing engine and Spectra 580 image-processing engine.
The connectivity options will support External 802.11ax, 2×2 MIMO, and Bluetooth Milan. The SD875 SoC will have support for latest Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM. It also comes with Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator. For audio the SD875 SoC ships with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec.
