Earlier we saw Realme teasing the new Realme 3 which is scheduled for early March launch. Now we finally have the first look at the upcoming Realme 3 along with specs of the device officially leaked.
As per the teaser, Realme finally shows up the new Realme 3 featuring dual rear cameras aligned vertically with LED flash below it. It brings back the Diamond cut design from the Realme 1 on the upcoming Realme 3 back. Further, we can see the 3.5 mm audio jack still present along with the micro USB port at the bottom of the device.
Realme 3 will retain the rear-mounted fingerprint scanner. Apart from that, the Realme CEO also leaked the processor details of the device. As per the teaser, the new Realme 3 will be powered by the MediaTek Helio P70 SoC. Yes, Realme is moving back to MediaTek for Realme 3. It also compares the MediaTek Helio P70 SoC with SD660 which claims that the Helio P70 loads games 40% faster than the SD660.
Further, we also got live images of the new Realme 3 appears online. As per the source, the new Realme 3 will not arrive with Diamond Cut finish instead will have polycarbonate or glass back with starry blue and starry purple gradient colors. At the bottom of the device, we have 3.5 mm audio jack and micro USB port.
