Earlier at MWC Qualcomm officially announced that they will soon replace the SD600 series with SD700 series and we also spotted the chipset on one of the unknown smartphones in the past. Today we have got the detailed specs of the upcoming SD700 series chipset.
As per the leaked image, we can see that Qualcomm is planning to introduce not one but two new chipsets under SD700 series with SD710 and SD730 SoC. The latest mid-range chipset the SD710 is built on Samsung 10 nm LPE process whereas the SD730 will be the first ever chip which is built on Samsung new 8nm LPP process which was finalised in Oct last year which will replace the 10nm LPE process.
The new SD710 is having two cores Kyro 3xx cores clocked at 2.2 GHz with 256KB L2 cache and six cores clocked at 1.7GHz using the Kyro 3xx cores with a 128KB L1 cache memory and 1MB L3 cache. The 730 chip comes with two cores Kyro 4xx cores clocked at 2.3 GHz with 256KB L2 cache and six cores clocked at 1.8GHz using the Kyro 4xx cores with a 128KB L2 cache memory and 1MB L3 cache. Both of the chipsets are coupled with Adreno 615 GPU with support for HDR10 enabled QHD display.
Both the chipset do come with LPDDR4X RAM support with speeds up to 1,866Mhz. Both the chipset do come with camera support up to 32MP with 3x concurrent cam and spectra 250 on SD710 and Spectra 350 on SD730 SoC. Both the chipset can shoot videos up to 4K. The connectivity option remains same on both the chipset with Dual-band Wifi, Bluetooth 5.0 on SD720 and Bluetooth 5.1 on SD730 SoC, UFS 2.1 storage support and will also have support for USB 3.1 Type-C port.
The SD730 will also have dedicated NPU whereas the SD710 SoC to have Hexagon Vector eXtensions for machine learning. The SD700 series is expected to launch in second half of 2018.
